"Silicon to Semiconductor Package":

Wafer-Fab:

The process starts with the fabrication of silicon wafers.
This involves creating integrated circuits on a silicon substrate.

Circuit Design:

Circuit schematics and layouts are designed using CAD tools.
This stage defines how the chip will function.

Wafer Sort:

Each die on the wafer is electrically tested.
Defective dies are identified and marked.

Die Prep:

Functional dies are cut from the wafer (dicing).
These dies are then prepared for packaging.

Wafer Level & Package Assembly:

Dies are attached to a substrate.
Wire bonding or flip-chip methods are used to connect the die to the package.
Uses substrates and other assembly materials.

Test:

Packaged chips are tested again for functionality.
Ensures quality and performance.

Finish:

Final inspection and quality assurance.
Chips may be labeled and prepared for shipping.

Board Assembly:

Finished chips are mounted onto printed circuit boards (PCBs).
This step integrates the chip into electronic systems